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Products Brief:
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, it measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.

Product's Feature

■ Non-contact measurement
■ Material:Si, GaAs, InP, Ge, etc.
■Thickness and TTV values are obtained by placing the wafer between non-contact capacitance probes.
■Thickness and TTV values are indicated on the high resolution LCD display.
■Provides High Performance at Low Cost.
■Menu-driven for Fast, Easy Setup.
■On-board Microprocessor for Accurate, Repeatable Measurements.
■Teflon Wafer Stage for Easy, Non-abrasive Positioning.

Technique Specification

■ Wafer Size: 50mm-300mm.
■ Thickness range: 0-1000 um
■ Thickness accuracy: + /-0.25um
■ TTV Measurement accuracy: + /-0.05um
■ Bow range: + /-500um [+ /-850um]
■ Bow accuracy: + /-2.0um
 

Application

■Slicing

■Saw set-up

　　　　■Thickness

　　　　■TTV

■Degradation monitoring

■Wire guide re-grooving

■Blade replacement

■Lap/etch and polishing

■Process monitoring

■Thickness

■TTV

■Material removal

■Bow

■Warp

■Flatness

■Backgrind

■Removal rate

■Final Inspection

■Lot sampling

■Final thickness

Typical Customer:

American,Europe and Asia and so on.